My name is Yanpeng Jia (贾彦鹏), I received the B.S. degree in Department of Mechanical Engineering from Harbin Institute of Technology, Weihai, China in 2023. I’m currently pursuing the M.S degree with the Shenyang Institute of Automation, Chinese Academy of Sciences. My current research interests include robot control, LiDAR Odometry and dynamic SLAM.
🔥 News
- 2025.02: 🎉🎉 Our paper CAD-Mesher is accepted to IEEE Trans. on MultiMedia 2025!
- 2024.12: 🎉🎉 Our paper TRLO is accepted to T-IM 2025!
- 2024.08: 🎉🎉 Our paper C-LOAM is accepted to IEEE ICUS 2024!
📖 Educations
- 2023.09 - present, Master, The State Key Laboratory of Robotics at Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, China.
- 2019.09 - 2023.06, Undergraduate, Department of Mechanical Engineering, Harbin Institute of Technology, Weihai, China.
📝 Publications
CAD-Mesher: A Convenient, Accurate, Dense Mesh-based Mapping Module in SLAM for Dynamic Environments
Yanpeng Jia, Fengkui Cao*, Ting Wang*, Yandong Tang, Shiliang Shao and Lianqing Liu
- An accurate, consecutive, and dense meshing module adapting to dynamic environments, which is plug-and-play for conveniently integrating with various LiDAR odometry to further improve the pose estimation accuracy and filter dynamic objects.
TRLO: An Efficient LiDAR Odometry with 3D Dynamic Object Tracking and Removal
Yanpeng Jia, Ting Wang*, Xieyuanli Chen and Shiliang Shao
- A dynamic LiDAR odometry that can filter dynamic objects through a 3D multi-object tracker and achieve more accurate pose estimation through bounding box posture consistency constraint.
A Compact LiDAR Odometry and Mapping with Dynamic Removal
Meifeng Zhang, Yanpeng Jia*, Shiliang Shao* and Shiyi Wang
- A compact LiDAR odometry that can filter dynamic objects, extract ground points, and segmentation through range image and achieve more accurate pose estimation through ground normal and z-axis constraint.
💻 Academic Services
Conference Reviewer: CVPR, ICCV, ECCV, IROS, ICRA, ICUS, ASCC
Journal Reviewer: T-RO, RA-L, T-MM, T-IV, T-IM